THOUGHT LEADERSHIP
This paper presents the survey for UCIe and BoW for die to die interconnect. The most significant benefits of UCIe and BoW are explored and the advantages one over another is highlighted that supports compute scaling by utilizing streaming (user defined) protocols to establish low latency connections between the Network on a-Chips (NoCs) of various server (or AI) dies in a single package and/or with the flexibility, and enabling heterogeneous integration
Nijwam Wary,Marquee Semiconductor Inc.
Mukesh Kumar Sukla,Marquee Semiconductor Inc.
David Ratchkov,Thrace Systems
DownloadThis paper presents the survey for UCIe and BoW for die to die interconnect. The most significant benefits of UCIe and BoW are explored and the advantages one over another is highlighted that supports compute scaling by utilizing streaming (user defined) protocols to establish low latency connections between the Network on a-Chips (NoCs) of various server (or AI) dies in a single package and/or with the flexibility, and enabling heterogeneous integration
Nijwam Wary,Marquee Semiconductor Inc.
Mukesh Kumar Sukla,Marquee Semiconductor Inc.
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